About ZICOTEC
Our company is deeply engaged in the R&D, production and practical application of thermoelectric modules (TEC), and acts as a professional integrated solution provider for thermoelectric temperature control. We integrate independent research & development, precision manufacturing, customized solution design and performance testing support. We have built a complete full-chain service system covering thermoelectric cooling chips, thermoelectric cooling modules and supporting heat sink assemblies. We can customize exclusive thermoelectric modules to fit practical requirements including equipment temperature control range, power consumption, installation dimensions and low-noise operation.
Our core R&D engineers previously worked for world top thermal management corporations such as Aavid and Laird, with abundant hands-on industrial experience. Supported by our seasoned thermal design and thermoelectric material R&D team, we provide full-process one-stop supporting services including thermoelectric module selection, matched heat dissipation structural design, prototype sampling, mass production and pre-shipment performance testing for multiple application fields: medical testing equipment, laboratory analytical instruments, optoelectronic components, industrial precision temperature control devices and small constant-temperature equipment.
Why We Founded This Company
Our company was founded in 2025. Our engineers have over 20 years of experience in thermal management design and product application. The industry has mature, highly efficient air cooling solutions, yet there is a severe lack of expertise in semiconductor TEC chip applications. Apart from globally renowned corporations, few Chinese manufacturers deliver reliable TEC-related products.
We possess in-depth expertise in core components such as heat sinks and liquid cooling plates. Our electronic and application engineers are recruited from well-established enterprises. We optimize and integrate all parts of thermoelectric modules to develop our own reliable products to serve clients. For the core TEC chips, we cooperate with Japanese firms and enterprises with British backgrounds. Their decades of mature semiconductor manufacturing processes guarantee stable performance of our thermoelectric modules.
What services can we provide for customers?
Our standard thermoelectric modules cover 50-500W, supporting Air to Air, Air to Plate and Air to Cold Plate structures. We offer matched heat sinks and liquid cooling plates, plus quick customization to fit various cooling equipment demands.
For heat sinks, we adopt various manufacturing processes including extruded profiles, skived fins, heat pipe welding and epoxy bonded fins. These processes greatly boost TEC performance and lower the temperature of its hot side.
For cold plates, we provide friction stir welded and brazed liquid cooling plates. Our refined channel design improves heat exchange efficiency to maximize TEC performance with COP above 90%, delivering stable operation for customer equipmen
We supply matching water pumps and chillers with customizable flow and lift, forming a complete circulating cooling system with cold plates to continuously dissipate heat from TEC hot sides.
We customize and optimize designs for customers via thermal simulation software including Ansys Icepak and Flotherm, simulating thermal conditions in advance to avoid overheating and shorten product R&D cycles.
We strictly follow the production system, procedures and quality standards of ISO9001, and also comply with IATF 16949 automotive quality specifications for comprehensive quality control of all products.
Production Equipment of Our Factory
Our factory is equipped with CNC machining centers, skiving machines, friction stir welders, vacuum brazing furnaces, module assembly lines and thermal test benches for full in-house production and quality inspection.
