Thermoelectric Cooler Assemblies
ZICOTEC independently develops and manufactures integrated thermoelectric cooler assemblies. Adopting advanced solid-state thermoelectric technology, it provides precise active cooling for sealed cabinets and precision instruments. Featuring excellent protection, it blocks dust and moisture to avoid condensation and corrosion. With refrigerant-free, vibration-free and dual-temperature control design, the modular maintenance-free structure adapts to complex conditions and reduces operational costs.
We offer standard models for various environments to meet customers' different application demands.
Air-to-Air Standard Assemblies
General Cavity Temperature Control
Air-to-Cold Plate Precision Assemblies
High-Accuracy Spot Cooling
Air-to-Plate High-Power Assemblies
Ultra High Heat-Flux Flagship Solution
What's a Thermoelectric Cooler Assemblies?
The core temperature control principle of thermoelectric cooler assemblies relies on the Peltier effect. By utilizing the thermoelectric conversion properties of semiconductor materials, the products achieve medium-free heat transfer. The internal structure consists of series arrays of N-type and P-type thermoelectric semiconductor chips. When supplied with DC power, internal carriers move directionally to form a stable heat conduction path, creating a consistent temperature difference between the two sides of the chips. The cold side absorbs heat rapidly to cool down heat-generating components, while the hot side continuously dissipates residual heat. By adjusting the magnitude and direction of the input current, the assembly switches freely between cooling and heating modes, adapting to diverse constant-temperature control requirements under different working conditions.
Advantages of ZICOTEC Thermoelectric Cooler Assemblies Manufacturing?
Boasting 15 years of professional accumulation in the precision thermal management industry, ZICOTEC has in-depth insights into diverse industrial temperature control demands. We have rich practical experience in TEC module design, structural optimization and scene adaptation, enabling us to deliver mature, stable and application-oriented thermal solutions for various complex working conditions.
All ZICOTEC TEC modules undergo rigorous standardized laboratory tests before mass production. We conduct comprehensive inspections covering thermal performance, electrical stability, operational safety and environmental adaptability. Strict testing procedures eliminate potential product defects and ensure every module delivers consistent, reliable and long-lasting working performance.
We adopt professional thermal simulation software to conduct full-process pre-analysis for product development and structural design. Accurate thermal simulation effectively predicts heat transfer efficiency and potential structural problems in advance, greatly shortening the product R&D cycle, optimizing design schemes and significantly reducing customer’s overall project development and iteration costs.
Equipped with complete and standardized automated production lines for TEC modules, ZICOTEC realizes integrated manufacturing from core chip assembly to finished product debugging. Our stable mass production capacity fully meets customers’ large-scale and batch ordering demands while ensuring uniform product quality and timely delivery efficiency.
Standard Thermoelectric Cooler Assemblies
We provide complete standard thermoelectric cooler assemblies for clients to select directly. If existing standard specifications cannot fit your working conditions, we support full-process customization and mass production. Our self-built professional workshops focus on the R&D and manufacturing of heat sinks and liquid cooling plates. Mature production lines bring us remarkable manufacturing and delivery advantages in complete thermal management supporting products.We deliver preliminary solutions and evaluation reports within 24 hours after receiving customer demands.
| Description | MFG part# | Cooling power Max (w) @ 35°C, dT=0°C | Operation Voltage (VDC) | TEM Current (A) | COP | TEM Resistance (Ω, ±10%, 23°C) | Over temperature (hot side) | Operation temperature range | IP Level | Noise level dB(A) |
| ID-032-12-AD | ZC-TEA260701 | 32 | 12 | 2.53-2.78 | >0.9 | 3.06-3.40-3.74 | 75°C | -10°Cto 55°C | NA | <42 |
| ID-130-24-AD | ZC-TEA260702 | 130 | 24 | 5.1-5.7 | >0.9 | 3.06-3.40-3.74 | 75°C | -10°Cto 55°C | NA | <55 |
| ID-190-24-AD | ZC-TEA260703 | 190 | 24 | 7.69-8.5 | >0.85 | 2.048-2.276-2.504 | 75°C | -10°Cto55°C | NA | <56 |
| ID-330-24-AD | ZC-TEA260704 | 329.8 | 24 | 13.2-14.5 | >0.85 | 1.24-1.38-1.52 | 75°C | -10°Cto55°C | NA | <63 |
| ID-120-24-AL | ZC-TEA260705 | 123 | 24 | 5.13-5.7 | >0.85 | 3.06-3.40-3.74 | 75°C | -10°Cto55°C | NA | <55 |
| ID-180-24-AL | ZC-TEA260706 | 181 | 24 | 7.65-8.5 | >0.9 | 2.048-2.276-2.504 | 75°C | -10°Cto55°C | NA | <56 |
| ID-320-24-AL | ZC-TEA260707 | 317.5 | 24 | 13.1-14.4 | >0.85 | 1.24-1.38-1.52 | 75°C | -10°Cto55°C | NA | <63 |
| ID-110-24-AA | ZC-TEA260708 | 113 | 24 | 5.1-5.7 | >0.8 | 3.06-3.40-3.74 | 75°C | -10°Cto55°C | NA | <55 |
| ID-165-24-AA | ZC-TEA260709 | 165 | 24 | 7.6-8.4 | >0.9 | 2.048-2.276-2.504 | 75°C | -10°Cto55°C | NA | <56 |
| OD-300-24-AA | ZC-TEA260710 | 297 | 24 | 13-14.3 | >0.9 | 1.24-1.38-1.52 | 75°C | -10°Cto55°C | NA | <63 |